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Development of Mechanical Heat Switch for Future Space Missions
https://jaxa.repo.nii.ac.jp/records/39558
https://jaxa.repo.nii.ac.jp/records/39558bdc01f03-84d7-4921-abf5-94435f226ea8
Item type | 会議発表論文 / Conference Paper(1) | |||||
---|---|---|---|---|---|---|
公開日 | 2015-10-14 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Development of Mechanical Heat Switch for Future Space Missions | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||
資源タイプ | conference paper | |||||
アクセス権 | ||||||
アクセス権 | metadata only access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_14cb | |||||
著者 |
Ando, Makiko
× Ando, Makiko× Shinozaki, Keisuke× Okamoto, Atsushi× Sugita, Hiroyuki× Nohara, Takehiro |
|||||
著者所属(英) | ||||||
en | ||||||
Japan Aerospace Exploration Agency(JAXA) | ||||||
著者所属(英) | ||||||
en | ||||||
Japan Aerospace Exploration Agency(JAXA) | ||||||
著者所属(英) | ||||||
en | ||||||
Japan Aerospace Exploration Agency(JAXA) | ||||||
著者所属(英) | ||||||
en | ||||||
Japan Aerospace Exploration Agency(JAXA) | ||||||
著者所属(英) | ||||||
en | ||||||
University of Tsukuba | ||||||
出版者(英) | ||||||
出版者 | American Institute of Aeronautics and Astronautics (AIAA) | |||||
書誌情報 | 発行日 2014-07 | |||||
会議概要(会議名, 開催地, 会期, 主催者等)(英) | ||||||
内容記述タイプ | Other | |||||
内容記述 | 44th International Conference on Environmental Systems(July 13-17, 2014.), Tucson, Arizona, United States. | |||||
抄録(英) | ||||||
内容記述タイプ | Other | |||||
内容記述 | The heat switch provides appropriate thermal switching (high or low thermal conductance) depending on the thermal environment around spacecraft. It has an advantage in terms of thermal control of spacecraft such as a lunar rover and planetary exploration spacecraft which have difficulty securing sufficient heater power to keep the spacecraft within its allowable temperature range. The authors have developed a paraffin-actuated heat switch. The required thermal performance is 1W/K as ON thermal conductance and 100 as ON/OFF thermal conductance ratio. The test model was fabricated and some activities to improve thermal performance were conducted, such as Au coating on the contact surfaces. A breadboard model (BBM) with the improved design was fabricated and its performance evaluated. Consequently, BBM achieved 1.6W/K as ON thermal conductance and 127 as ON/OFF ratio. | |||||
資料番号 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 資料番号: PA1510100000 | |||||
レポート番号 | ||||||
内容記述タイプ | Other | |||||
内容記述 | レポート番号: ICES-2014-124 |