{"created":"2023-06-20T14:49:38.705839+00:00","id":17545,"links":{},"metadata":{"_buckets":{"deposit":"027884ae-f06b-43c0-a1eb-ec0342f960ed"},"_deposit":{"created_by":1,"id":"17545","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"17545"},"status":"published"},"_oai":{"id":"oai:jaxa.repo.nii.ac.jp:00017545","sets":["1543:1712:1717","1887:1891"]},"author_link":["158936","158941","158938","158937","158940","158939"],"item_5_alternative_title_2":{"attribute_name":"その他のタイトル（英）","attribute_value_mlt":[{"subitem_alternative_title":"Local Residual Stress and Deformation of Si Chips Mounted on Flip Chip Structures and Their Effect on Structural Reliability of Products"}]},"item_5_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2011-04","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"29","bibliographicPageStart":"14","bibliographic_titles":[{"bibliographic_title":"第21回高温エレクトロニクス研究会"},{"bibliographic_title":"Proceedings of the 21st ISAS Research Meeting on HIGH TEMPERATURE ELECTRONICS","bibliographic_titleLang":"en"}]}]},"item_5_description_14":{"attribute_name":"会議概要（会議名, 開催地, 会期, 主催者等）","attribute_value_mlt":[{"subitem_description":"第21回高温エレクトロニクス研究会（2011年3月2日. 宇宙航空研究開発機構宇宙科学研究所（JAXA)(ISAS)）, 相模原市, 神奈川県","subitem_description_type":"Other"}]},"item_5_description_15":{"attribute_name":"会議概要（会議名, 開催地, 会期, 主催者等）（英）","attribute_value_mlt":[{"subitem_description":"The 21st ISAS Research Meeting on High Temperature Electronics (March 2, 2011. Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency (JAXA)(ISAS)), Sagamihara, Kanagawa Japan","subitem_description_type":"Other"}]},"item_5_description_32":{"attribute_name":"資料番号","attribute_value_mlt":[{"subitem_description":"資料番号: SA6000018003","subitem_description_type":"Other"}]},"item_5_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"宇宙航空研究開発機構宇宙科学研究所 (JAXA)(ISAS)"}]},"item_5_publisher_9":{"attribute_name":"出版者（英）","attribute_value_mlt":[{"subitem_publisher":"Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency (JAXA)(ISAS)"}]},"item_5_text_6":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"東北大学大学院工学研究科附属エネルギー安全科学国際研究センター"},{"subitem_text_value":"東北大学大学院工学研究科附属エネルギー安全科学国際研究センター"},{"subitem_text_value":"東北大学大学院工学研究科附属エネルギー安全科学国際研究センター"}]},"item_5_text_7":{"attribute_name":"著者所属（英）","attribute_value_mlt":[{"subitem_text_language":"en","subitem_text_value":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University"},{"subitem_text_language":"en","subitem_text_value":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University"},{"subitem_text_language":"en","subitem_text_value":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"metadata only access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_14cb"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"中平, 航太"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"鈴木, 研"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"三浦, 英生"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nakahira, Kota","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Suzuki, Ken","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Miura, Hideo","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"conference paper","resourceuri":"http://purl.org/coar/resource_type/c_5794"}]},"item_title":"フリップチップ実装構造における局所残留応力・変形の発生と構造信頼性への影響","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"フリップチップ実装構造における局所残留応力・変形の発生と構造信頼性への影響"}]},"item_type_id":"5","owner":"1","path":["1717","1891"],"pubdate":{"attribute_name":"公開日","attribute_value":"2015-03-26"},"publish_date":"2015-03-26","publish_status":"0","recid":"17545","relation_version_is_last":true,"title":["フリップチップ実装構造における局所残留応力・変形の発生と構造信頼性への影響"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-06-21T04:36:42.084420+00:00"}