@techreport{oai:jaxa.repo.nii.ac.jp:00001931,
 author = {中嶋, 大 and 薙野, 綾 and 穴吹, 直久 and 林田, 清 and 常深, 博 and 尾崎, 正伸 and Doty, John P. and Nakajima, Hiroshi and Nagino, Ryo and Anabuki, Naohisa and Hayashida, Kiyoshi and Tsunemi, Hiroshi and Ozaki, Masanobu and Doty, John P.},
 month = {Feb},
 note = {ASTRO-H 衛星搭載の軟X線撮像検出器(SXI:Soft X-ray Imager) は軟X線望遠鏡(SXT : Soft X-ray Telescope) の焦点面に配置される。田の字型に配置された4 枚の大面積CCD 素子が、38 分角四方と、ASTRO-H 搭載検出器としては最も広い視野を構成し、0.4-12 keV のエネルギー帯域で撮像分光観測を行う。SXI のフロントエンド回路には、アナログデジタル混在ASIC (application-specic integrated circuit) を採用している。従来の個別回路部品で構成される信号処理回路を大幅に小型化、軽量化している。ASIC 単体での機能と性能、さらに放射線耐性の実証を完了した後、JAXA 集積回路仕様書に準拠したQCI(quality conformance inspection) 試験と、フライトモデル候補全数に対するバーンイン試験を実施した。特にバーンイン試験は、通電かつCCD の疑似信号を処理させた状態のダイナミックバーンイン試験を行った。+115C、200 時間の試験の前後で、入力等価雑音、積分非線形性、ゲインを測定した結果、供試体32 素子全てについて、故障や性能劣化がないことが確認された。この結果を基にフライトモデル8 素子が選定され、SXI カメラボディ内部の電子回路基板に実装された。, Soft X-ray Imager (SXI) is the primary imaging instrument on board the X-ray astronomical satellite ASTRO-H. The focal plane assembly consists of the four large-area P-channel CCDs abutted into a 2 × 2 array and the signal processing board including mixed-signal ASICs (applicationspecific integrated circuit). Given the focal length of 5.6 m, the four chips cover a region of 38’ × 38’ on the sky combined with the Soft X-ray Telescope. One of the advancements of SXI compared with conventional on board CCD cameras is the signal processing using mixed-signal ASICs with the function of the preamplifier and the analog-to-digital conversion. The dedicated design of the delta sigma modulators enables us to achieve high signal-to-noise ratio with the relatively small number of the transistors. It simultaneously processes the analog signals from the four readout nodes. After the verification of the performance such as the input equivalent noise, linearity, gain and radiation tolerance, we performed the quality conformance inspection test in accordance with the JAXA parts program, followed by the burn-in test for all the flight chip candidates. The dynamic burn-in test was carried out with the temperature of +115C in the duration of 200 hours to expose the initial malfunction in the mission. Pseudo CCD signals are fed into all the devices during the test. There was no trouble in functional point of view and the performance showed no change after the dynamic burn-in. The eight flight model chips have been selected and mounted on the signal processing board., 形態: カラー図版あり, Physical characteristics: Original contains color illustrations, 資料番号: AA1530003000, レポート番号: JAXA-RR-14-007},
 title = {ASTRO-H衛星搭載軟X線撮像検出器(SXI)信号処理用ASICのスクリーニング},
 year = {2015}
}