@misc{oai:jaxa.repo.nii.ac.jp:00020965,
 author = {徳江, 喜泰 and 中川, 剛 and 根本, 規生 and 篠崎, 孝一 and 南, 海音子 and Tokue, Yoshihiro and Nakagawa, Tsuyoshi and Nemoto, Norio and Shinozaki, Koichi and Minami, Mineko},
 month = {Nov},
 note = {第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城, The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba International Congress Center), Tsukuba, Ibaraki, Japan, 形態: カラー図版あり, Physical characteristics: Original contains color illustrations, 資料番号: AD1710002016},
 title = {Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications},
 year = {2010}
}