{"created":"2023-06-20T14:52:48.675085+00:00","id":20965,"links":{},"metadata":{"_buckets":{"deposit":"e24a550e-4970-4f04-847b-8f653e1250d8"},"_deposit":{"created_by":1,"id":"20965","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"20965"},"status":"published"},"_oai":{"id":"oai:jaxa.repo.nii.ac.jp:00020965","sets":["1543:1802:1807","1887:1891"]},"author_link":["199154","199149","199151","199150","199148","199152","199155","199146","199147","199153"],"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2010-11-10","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"26","bibliographicPageStart":"1","bibliographic_titles":[{}]}]},"item_4_description_14":{"attribute_name":"会議概要（会議名, 開催地, 会期, 主催者等）","attribute_value_mlt":[{"subitem_description":"第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城","subitem_description_type":"Other"}]},"item_4_description_15":{"attribute_name":"会議概要（会議名, 開催地, 会期, 主催者等）（英）","attribute_value_mlt":[{"subitem_description":"The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba International Congress Center), Tsukuba, Ibaraki, Japan","subitem_description_type":"Other"}]},"item_4_description_18":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"形態: カラー図版あり","subitem_description_type":"Other"}]},"item_4_description_19":{"attribute_name":"内容記述（英）","attribute_value_mlt":[{"subitem_description":"Physical characteristics: Original contains color illustrations","subitem_description_type":"Other"}]},"item_4_description_32":{"attribute_name":"資料番号","attribute_value_mlt":[{"subitem_description":"資料番号: AD1710002016","subitem_description_type":"Other"}]},"item_4_link_13":{"attribute_name":"外部本文リンク","attribute_value_mlt":[{"subitem_link_url":"https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/data/11-08.pdf"}]},"item_4_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"宇宙航空研究開発機構研究開発本部電子部品・デバイス・材料グループ(JAXA)"}]},"item_4_publisher_9":{"attribute_name":"出版者（英）","attribute_value_mlt":[{"subitem_publisher":"Electronic Devices and Materials Group, Aerospace Research and Development Directorate, Japan Aerospace Exploration Agency (JAXA)"}]},"item_4_relation_12":{"attribute_name":"関係URI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/presentation_e.htm"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/presentation_e.htm","subitem_relation_type_select":"URI"}}]},"item_4_text_6":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"福島アビオニクス株式会社"},{"subitem_text_value":"日本アビオニクス株式会社"},{"subitem_text_value":"宇宙航空研究開発機構(JAXA)"},{"subitem_text_value":"宇宙航空研究開発機構(JAXA)"},{"subitem_text_value":"宇宙航空研究開発機構(JAXA)"}]},"item_4_text_7":{"attribute_name":"著者所属（英）","attribute_value_mlt":[{"subitem_text_language":"en","subitem_text_value":"Avionics Fukushima Co., Ltd."},{"subitem_text_language":"en","subitem_text_value":"Nippon Avionics Co., Ltd."},{"subitem_text_language":"en","subitem_text_value":"Japan Aerospace Exploration Agency (JAXA)"},{"subitem_text_language":"en","subitem_text_value":"Japan Aerospace Exploration Agency (JAXA)"},{"subitem_text_language":"en","subitem_text_value":"Japan Aerospace Exploration Agency (JAXA)"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"metadata only access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_14cb"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"徳江, 喜泰"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"中川, 剛"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"根本, 規生"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"篠崎, 孝一"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"南, 海音子"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Tokue, Yoshihiro","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nakagawa, Tsuyoshi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nemoto, Norio","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Shinozaki, Koichi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Minami, Mineko","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"conference object","resourceuri":"http://purl.org/coar/resource_type/c_c94f"}]},"item_title":"Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications","subitem_title_language":"en"}]},"item_type_id":"4","owner":"1","path":["1807","1891"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-05-19"},"publish_date":"2017-05-19","publish_status":"0","recid":"20965","relation_version_is_last":true,"title":["Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-06-21T03:42:11.134320+00:00"}